收藏本站
Chapter 3
TSSEVB Interfaces
3.1
MC9S08JM60 Comm MCU
TSSEVB includes a MC9S08JM60 Comm MCU that works as a bridge between MC9S08LG32 and the
PC when using the EGT.
The MC9S08JM60 Comm MCU is loaded with the firmware that allows:
? Communication with the MC9S08LG32 microcontroller through the IIC protocol
? Communication with the PC through the USB protocol
TSSEVB offers the possibility to connect the MC9S08LG32 MCU with the MC9S08JM60 Comm MCU
using the SCI module. In the communication port, all the communication modules of the MC9S08JM60
Comm MCU (SCI, IIC, and SPI) are mapped.
3.1.1
Re-Programming MC9S08JM60 Comm MCU on the TSSEVB
If the firmware loaded from factory of the MC9S08JM60 Comm MCU is lost or somehow corrupted, you
can reload the firmware back into the MC9S08JM60 Comm MCU.
To re-program the MC9S08JM60 Comm MCU:
1. Ensure that you have installed the latest version of CodeWarrior Development Studio, available on
the Freescale web site at www.frescale.com .
2. Download the latest version of the TSSEVB USB Bridge file from the Freescale web site at
www.frescale.com/touchsensing .
3. Connect the PC to the MC9S08JM60 Comm MCU USB connector. To locate the MC9S08JM60
Comm MCU USB connector, refer to Section Section 2.1.1 .
4. Select the MC9S08JM60 Comm MCU as target of the OSBDM by setting jumpers on position 1–3
and 2–4 from connector J6 on the TSSEVB. Figure 3-1 shows the required configuration of
connector J6.
Figure 3-1. MC9S08JM60 Comm MCU programming configuration
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor
3-1
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
TSW169N202/90 T-STRUT 16.85"X1" FOR CARD RACK
TT129X PATCHCORD 3-COND 6.0FT
TTL-232RG-VREG3V3-WE CABLE USB SERIAL 3.3V WIRE 250MA
TUNAG001 MODULE MEMS COMPASS SPI CM1015
TUNAG002 BOARD EVAL MEMS COMPASS CM1015
TUNAG003 MODULE MEMS COMPASS I2C CM1020
TWN1.50SV THERMASHIELD WRAP 1.50" SLV 200'
TWR-SENSOR-PAK TOWER SYSTEM SENSOR PAK
相关代理商/技术参数
TSSF 61 S-J 制造商:knitter-switch 功能描述:
TSSF212H100 功能描述:THERMISTOR FLOAT SWTCH 制造商:cynergy 3 系列:* 零件状态:有效 标准包装:1
TSSF212Y100 功能描述:THERMISTOR FLOAT SWTCH 制造商:cynergy 3 系列:* 零件状态:有效 标准包装:1
TSSF4500 功能描述:红外发射源 22 Degree 35mW 870nm Side View RoHS:否 制造商:Fairchild Semiconductor 波长:880 nm 射束角:+/- 25 辐射强度: 最大工作温度:+ 100 C 最小工作温度:- 40 C 封装 / 箱体:Side Looker 封装:Bulk
TSSF4500 制造商:Vishay Semiconductors 功能描述:IR Emitting Diode
TSSF4500_08 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:High Speed Infrared Emitting Diode, RoHS Compliant, 890 nm, GaAlAs Double Hetero
TSSF4500-ASZ 制造商:Vishay Sprague 功能描述:
TSSG3A 制造商:Siemens 功能描述:BREAKER NGG 3P TRML SHIELD LINE OR LOAD